Method for manufacturing semiconductor device and semiconductor device
AssigneeMitsubishi Electric Corporation
InventorDaisuke MURATA
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Abstract
A coating process of a coating liquid using a nozzle is performed on a coating target structure including a semiconductor element and a wire bonded to the semiconductor element by a wire bonding process. The nozzle has a transport wind generating function of generating a liquid transport wind in a spiral manner. Thus, the coating liquid discharged from the coating liquid supply port of the nozzle is supplied to the coating target structure along the directivity of the liquid transport wind. Then, a drying process is performed on the coating target structure to form a primary layer containing a silane coupling agent as a constituent material on an outer periphery of the wire.
Claims7
A method for manufacturing a semiconductor device, the method comprising the steps of:
- (a) preparing a coating target structure including a semiconductor element and a wire electrically connected to the semiconductor element;
- (b) performing a coating process of supplying a coating liquid from a coating liquid supply port toward the coating target structure using a nozzle disposed above the coating target structure and having the coating liquid supply port;
- and
- (c) drying the coating target structure after the step (b) is performed;
- the coating liquid containing a silane coupling agent,
- the nozzle having a transport wind generating function of generating a liquid transport wind that spirally swirls downward, and
- the coating liquid being supplied to the coating target structure along a flow of the liquid transport wind.
Dependencies are inferred from the claim text.