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US 12,257,622 B2Granted
Joining material, production method for joining material, and joined body
AssigneeSenju Metal Industry Co., Ltd.
InventorJinting Jiu
Life of this patent
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Abstract
In the joined body (10) in which the conductor (12) and the substrate (14) are joined by the joining material (13), the joining material (13) includes a sintered body formed by sintering silver powder. A sintered body having a porosity of 8% to 30% and a surface roughness Ra of a joining surface of 500 nm or more and 3.3 μm or less is adopted.
Claims13
A joining material comprising:
- a sintered body consisting of a sintered product of silver powder containing a first silver particle group and a second silver particle group having different average particle diameters,
- wherein an average particle diameter of the first silver particle group is 50 nm or more and less than 1000 nm, and an average particle diameter of the second silver particle group is 1 μm or more and less than 20 μm,
- wherein a porosity of the sintered body is 8% to 30%, the porosity of the sintered body is measured by
- first immersing the sintered body in water to measure a volume of the sintered body, and
- second measuring a mass of the sintered body;
- wherein the volume in a case where the sintered body does not have pores corresponding to the mass thereof is calculated based on a theoretical density;
- and
- wherein the porosity of the sintered body is calculated from the measured volume and the theoretical volume in a case where there are no pores, and
- a surface roughness Ra of a joining surface is 1.06 μm or more and 3.3 μm or less.
6 more elements
Dependencies are inferred from the claim text.