H10W 72/01361
Chemical or physical modification
Official title: {Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01351)}
H10W72/01361 (Chemical or physical modification) appears on 157 US grants and 220 published applications in this corpus.
Search patents in H10W- Granted patents
- 157
- Published applications
- 220
- Assignees
- 109
- Inventors
- 503
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 0 |
| 2003 | 1 | 2 |
| 2004 | 0 | 0 |
| 2005 | 2 | 2 |
| 2006 | 0 | 2 |
| 2007 | 4 | 5 |
| 2008 | 2 | 1 |
| 2009 | 2 | 4 |
| 2010 | 2 | 6 |
| 2011 | 1 | 2 |
| 2012 | 2 | 8 |
| 2013 | 5 | 6 |
| 2014 | 4 | 7 |
| 2015 | 7 | 12 |
| 2016 | 11 | 12 |
| 2017 | 5 | 19 |
| 2018 | 17 | 18 |
| 2019 | 17 | 17 |
| 2020 | 13 | 17 |
| 2021 | 13 | 14 |
| 2022 | 10 | 14 |
| 2023 | 11 | 11 |
| 2024 | 8 | 12 |
| 2025 | 8 | 14 |
| 2026 | 7 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same29 Sep 2026US 12,751,310 B2Furukawa Electric Co., Ltd.
- Method for manufacturing semiconductor apparatus and semiconductor apparatus8 Sep 2026US 12,733,511 B2Rohm Co., Ltd.
- EMI cage for microstrip routing via dual layer underfill concept18 Aug 2026US 12,713,928 B2Intel Corporation
- Electronic assembly having a power semiconductor component between two circuit carriers, and method for producing same11 Aug 2026US 12,707,570 B2Robert Bosch GmbH
- Display device using semiconductor light-emitting element28 Jul 2026US 12,696,600 B2LG Electronics Inc.
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Method of manufacturing a plurality of semiconductor devices as well as a corresponding semiconductor device24 Sep 2026US 2026/0293703 A1Nexperia B. V.
- Method and lead frame with die attach film23 Jul 2026US 2026/0215291 A1
- Semiconductor device including narrow gap underfill material2 Jul 2026US 2026/0191088 A1SanDisk Technologies LLC
- Anisotropic conductive bonding material and bonded structure using the same4 Jun 2026US 2026/0157215 A1Electronics and Telecommunications Research Institute
Most cited
By later US patents
- Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices266US 6,326,698 B1Micron Technology, Inc. · 2001
- Nitride-enriched oxide-to-oxide 3D wafer bonding258US 9,496,239 B1International Business Machines Corporation · 2016
- Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed62US 6,544,821 B2Micron Technology, Inc. · 2003
- Anisotropically conducting adhesive, and process for producing an anisotropically conducting adhesive47US 5,891,366 ARobert Bosch GmbH · 1999
- Method and apparatus for forming an underfill adhesive layer39US 6,352,881 B1National Semiconductor Corporation · 2002