Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
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Abstract
A method for forming packaged substrates, including flip-chip dice individually or in a multi-die wafer. The method includes using a stereolithographic process to form a protective dielectric polymeric sealing structure on at least the active surface of the substrate. In addition, the invention encompasses forming a similar layer on a second substrate to be joined to the first substrate. Contact pads of the second substrate are exposed through the layer thereon to facilitate joining of the two substrates. Semiconductor devices formed by the method are also disclosed.
Claims40
A method for packaging at least one semiconductor device, comprising:
- providing at least one semiconductor device with at least one contact pad exposed at a surface thereof;
- forming a layer comprising liquid photopolymer on said surface;
- and subjecting at least one region of said layer to radiation to at least partially polymerize
- photopolymer in said at least one region.
A method for forming sealed electrical connections between at least one flip-chip type semiconductor device and a carrier substrate, comprising:
- providing at least one semiconductor device comprising at least one bond pad-bearing surface;
- forming at least one layer comprising at least semisolid material on said at least one bond pad-bearing surface with at least one bond pad of said at least one semiconductor device being electrically exposed therethrough;
- providing a carrier substrate comprising at least one contact pad located correspondingly to said at least one bond pad;
- forming a layer comprising polymeric material on said surface of said carrier substrate with said at least one contact pad being electrically exposed therethrough;
- securing at least one conductive structure to at least one of said at least one bond pad and said at least one contact pad;
- aligning said at least one bond pad and said at least one contact pad;
- and
- connecting said at least one conductive structure between said at least one bond pad and said at least one contact pad.
A method for simultaneously packaging a plurality of semiconductor devices, comprising:
- providing a substrate comprising semiconductor devices fabricated thereon;
- securing conductive structures to bond pads of at least some of said semiconductor devices;
- recognizing a location and orientation of bond pads of at least some of said semiconductor devices;
- and
- stereolithographically forming protective structures comprising at least one semisolid layer over at least some of said semiconductor devices with said conductive structures extending through said protective structures.
A semiconductor device assembly comprising:
- a first substrate comprising at least one first bond pad;
- at least one first layer of at least semisolid photopolymer on a surface of said first substrate with said at least one first bond pad electrically exposed therethrough;
- a second substrate comprising at least one second bond pad;
- at least one second layer of at least semisolid photopolymer on a surface of said second substrate with said at least one second bond pad electrically exposed therethrough, said at least one first bond pad and said at least one second bond pad being correspondingly positioned, said at least one first layer and said at least one second layer contacting one another;
- and
- at least one conductive structure communicating with said at least one first bond pad and said at least one second bond pad.
A packaged semiconductor device, comprising:
- a semiconductor device;
- and
- a plurality of layers of at least semisolid photopolymer on at least an active surface of said semiconductor device, said plurality of layers being at least partially superimposed, contiguous, and mutually adhered, at least one bond pad of said semiconductor device being electrically exposed through said plurality of layers.
Dependencies are inferred from the claim text.