Electronic assembly having a power semiconductor component between two circuit carriers, and method for producing same

An electronic assembly, comprising:

• a power semiconductor component and a circuit carrier, the power semiconductor component having at least one contact region on each of opposite sides of the power semiconductor component, and at least of the contact regions facing the circuit carrier being in electrical contact with a connection region of the circuit carrier;
• wherein the power semiconductor component is in electrical contact on a side facing away from the circuit carrier, in a region of at least one of the contact regions of the power semiconductor component, with a further circuit carrier, an additively generated connecting layer is arranged on the at least one contact region and/or the connection region of the circuit carriers, and the at least one connecting layer is connected to the connection region and/or the contact region by a solder connection;
• wherein the connecting layer has a lower modulus of elasticity in a direction extending perpendicularly to a surface of the power semiconductor component than in a direction extending in parallel with the surface of the power semiconductor component.