Semiconductor device including narrow gap underfill material
AssigneeSanDisk Technologies LLC
InventorsNagesh Vodrahalli, Chih Yang Li, Mutharasu Devarajan
Life of this patent
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Abstract
A semiconductor device includes a number of stacked semiconductor dies and a partial, controlled amount of underfill material between each semiconductor die. The underfill material fills a central portion of the space between adjacent semiconductor dies, leaving an edge gap in the space around the underfill material. After the die stack has been completed, the stack may be encapsulated in mold compound. In addition to covering the surfaces of the die stack, the mold compound fills the edge gap so that all spaces between dies are filled.
Claims20
A semiconductor device, comprising:
- a plurality of semiconductor dies stacked on each other, a space being defined between a pair of adjacent semiconductor dies of the plurality of semiconductor dies;
- an underfill material partially filling the space between the pair of adjacent semiconductor dies;
- and
- a mold compound encapsulating the semiconductor device and partially filling the space between the pair of adjacent semiconductor dies;
- wherein the underfill material and the mold compound together entirely fill the space between the pair of adjacent semiconductor dies.
A semiconductor device, comprising:
- a plurality of semiconductor dies stacked on each other, a space being defined between a pair of adjacent semiconductor dies of the plurality of semiconductor dies;
- an underfill material partially filling a central portion of the space between the pair of adjacent semiconductor dies, the underfill material leaving an edge gap around a periphery of the underfill material in the space that is empty;
- and
- a mold compound encapsulating the semiconductor device and filling the edge gap;
- wherein the underfill material and the mold compound together entirely fill the space between the pair of adjacent semiconductor dies.
A semiconductor device, comprising:
- a plurality of semiconductor dies stacked on each other, a space being defined between a pair of adjacent semiconductor dies of the plurality of semiconductor dies;
- filler means, comprising an underfill material surrounded by a mold compound, for entirely filling the space without bleeding outside of a footprint of one of the semiconductor dies of the pair of semiconductor dies.
Dependencies are inferred from the claim text.