H10W 72/01321
Using local deposition
Official title: {using local deposition}
H10W72/01321 (Using local deposition) appears on 808 US grants and 1,038 published applications in this corpus.
Search patents in H10W- Granted patents
- 808
- Published applications
- 1,038
- Assignees
- 333
- Inventors
- 1,970
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 1 |
| 2003 | 1 | 2 |
| 2004 | 1 | 3 |
| 2005 | 1 | 4 |
| 2006 | 2 | 6 |
| 2007 | 5 | 3 |
| 2008 | 3 | 6 |
| 2009 | 2 | 5 |
| 2010 | 2 | 11 |
| 2011 | 3 | 14 |
| 2012 | 9 | 34 |
| 2013 | 20 | 50 |
| 2014 | 32 | 68 |
| 2015 | 60 | 89 |
| 2016 | 62 | 98 |
| 2017 | 81 | 71 |
| 2018 | 66 | 69 |
| 2019 | 69 | 98 |
| 2020 | 90 | 110 |
| 2021 | 49 | 83 |
| 2022 | 73 | 60 |
| 2023 | 68 | 42 |
| 2024 | 47 | 47 |
| 2025 | 31 | 37 |
| 2026 | 23 | 27 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Adhesive dispense unit25 Aug 2026US 12,721,090 B2Nexperia B. V.
- Energy augmentation structures for use with energy emitters and collectors11 Aug 2026US 12,702,861 B2Immunolight, LLC
- Electronic assembly having a power semiconductor component between two circuit carriers, and method for producing same11 Aug 2026US 12,707,570 B2Robert Bosch GmbH
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
- Method of manufacturing a plurality of semiconductor devices as well as a corresponding semiconductor device24 Sep 2026US 2026/0293703 A1Nexperia B. V.
- Sintering film frames and related methods24 Sep 2026US 2026/0293736 A1Semiconductor Components Industries, LLC
- Thermally conductive sheet and method for manufacturing same17 Sep 2026US 2026/0282904 A1Sekisui Chemical Co., Ltd.
Most cited
By later US patents
- Laser assisted transfer welding process144US 9,161,448 B2Semprius, Inc. · 2015
- Semiconductor device and method of forming an embedded SOP fan-out package74US 9,385,006 B2STATS ChipPAC Pte. Ltd. · 2016
- Electrically bonded arrays of transfer printed active components67US 9,049,797 B2Semprius, Inc. · 2015
- Package structure and method of forming the same61US 10,037,963 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Electronic component and adhesive strip combination, and method of attachment of component to a substrate46US 4,489,487 ARobert Bosch GmbH · 1984