H10W 72/01325
In solid form
Official title: {in solid form}
H10W72/01325 (In solid form) appears on 306 US grants and 376 published applications in this corpus.
Search patents in H10W- Granted patents
- 306
- Published applications
- 376
- Assignees
- 147
- Inventors
- 769
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 2 |
| 2006 | 0 | 1 |
| 2007 | 2 | 2 |
| 2008 | 1 | 2 |
| 2009 | 1 | 1 |
| 2010 | 1 | 4 |
| 2011 | 0 | 3 |
| 2012 | 4 | 13 |
| 2013 | 5 | 17 |
| 2014 | 13 | 38 |
| 2015 | 26 | 34 |
| 2016 | 23 | 42 |
| 2017 | 33 | 33 |
| 2018 | 24 | 21 |
| 2019 | 26 | 30 |
| 2020 | 34 | 35 |
| 2021 | 18 | 34 |
| 2022 | 21 | 25 |
| 2023 | 33 | 16 |
| 2024 | 16 | 9 |
| 2025 | 9 | 9 |
| 2026 | 7 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Semiconductor device and method for manufacturing the semiconductor device28 Jul 2026US 12,696,825 B2Denso Corporation
- Selective transfer of micro devices14 Jul 2026US 12,684,691 B2VueReal Inc.
- Member, conductive layer, method for manufacturing member, and method for forming conductive layer9 Jun 2026US 12,651,852 B2Ricoh Company, Ltd.
- Anisotropic conductive film and display device including same28 Apr 2026US 12,615,931 B2Samsung Display Co., Ltd.
- Semiconductor package with antenna16 Jul 2026US 2026/0206603 A1
- Method of joining electrical and mechanical components using laminated modular preforms30 Apr 2026US 2026/0123502 A1Alpha Assembly Solutions Inc.
- Package structure with adhesive element over semiconductor chip27 Nov 2025US 2025/0364425 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure with protective lid13 Nov 2025US 2025/0349787 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic structure including an interconnection film30 Oct 2025US 2025/0336868 A1
Most cited
By later US patents
- Semiconductor device and method of forming an embedded SOP fan-out package74US 9,385,006 B2STATS ChipPAC Pte. Ltd. · 2016
- Package structure and method of forming the same61US 10,037,963 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Electronic component and adhesive strip combination, and method of attachment of component to a substrate46US 4,489,487 ARobert Bosch GmbH · 1984
- 3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix23US 9,871,014 B2Invensas Corporation · 2018
- Apparatus for aligning and soldering multiple electrode pedestals to the solderable ohmic contacts of semiconductor components22US 4,194,668 ABBC Brown, Boveri & Company, Limited · 1980