3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix

A method of joining microelectronic components, comprising:

• forming an adhesive matrix between two surfaces to be joined, the adhesive matrix comprising conductive members aligned vertically in an adhesive medium, wherein forming the adhesive matrix between two surfaces to be joined further comprises:
• forming aligned carbon nanotubes or aligned coated wires on a surface of a standalone substrate;
• applying the adhesive medium into the aligned carbon nanotubes or the aligned coated wires at the surface of the standalone substrate to make a layer of the adhesive medium of the adhesive matrix;
• removing the standalone substrate from the adhesive matrix to reveal a standalone adhesive matrix with the aligned carbon nanotubes or aligned coated wires flush with one surface of the layer of the adhesive medium;
• and
• placing the adhesive matrix between the two surfaces to be joined;
• pressing the two surfaces together to conductively connect respective electrical contacts on the two surfaces via the conductive members in the adhesive matrix, the respective electrical contacts at least partially aligned with each other along a vertical line;
• and
• securing the two surfaces together with the adhesive medium within the adhesive matrix.

A method of joining microelectronic components, comprising:

• forming an adhesive matrix between two surfaces to be joined, the adhesive matrix comprising conductive members aligned vertically in an adhesive medium;
• coating the electrical contacts of at least one surface of the two surfaces with a solder or a flowable joining material;
• pressing the two surfaces together to conductively connect respective electrical contacts on the two surfaces via the conductive members in the adhesive matrix, the respective electrical contacts at least partially aligned with each other along a vertical line;
• and
• securing the two surfaces together with the adhesive medium within the adhesive matrix, wherein the conductive members in the adhesive matrix bend, kink, or break upon engaging a hard surface of an area that is not a conductive contact to nonconductively bond the two surfaces together where there is no overlap of the vertically corresponding electrical contacts of the two surfaces.

A microelectronic package, comprising:

• an interface between two components of the microelectronic package;
• an adhesive matrix of the interface to secure the two components together;
• conductive members in the adhesive matrix anisotropically aligned to automatically establish electrical connections between at least partially aligned contacts on each of the two components while the adhesive matrix provides nonconductive adhesion between parts of the two components lacking the at least partially aligned contacts;
• and
• a solder applied to the at least partially aligned contacts of one of the two components, wherein the solder has a lower melting temperature than an adhesive medium of the adhesive matrix.

A microelectronic package, comprising:

• an interface between two components of the microelectronic package;
• an adhesive matrix of the interface to secure the two components together;
• conductive members in the adhesive matrix anisotropically aligned to automatically establish electrical connections between at least partially aligned contacts on each of the two components while the adhesive matrix provides nonconductive adhesion between parts of the two components lacking the at least partially aligned contacts;
• wherein the adhesive matrix complies to variances in distances between parts of the two components;
• wherein conductive members in the adhesive matrix compliantly establish electrical connections between at least partially aligned contacts at various distances apart from each other on each of the two components;
• and
• wherein the adhesive matrix provides compliant nonconductive adhesion between nonelectrical parts of the two components at various distances apart from each other.

A microelectronic package, comprising:

• an interface between two components of the microelectronic package;
• an adhesive matrix of the interface to secure the two components together;
• conductive members in the adhesive matrix anisotropically aligned to automatically establish electrical connections between at least partially aligned contacts on each of the two components while the adhesive matrix provides nonconductive adhesion between parts of the two components lacking the at least partially aligned contacts;
• and
• wherein the conductive members of the adhesive matrix dissipate heat from at least one of the two components.