H10W 72/01323
In liquid form
Official title: {in liquid form, e.g. by dispensing droplets or by screen printing}
H10W72/01323 (In liquid form) appears on 594 US grants and 770 published applications in this corpus.
Search patents in H10W- Granted patents
- 594
- Published applications
- 770
- Assignees
- 284
- Inventors
- 1,499
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 2 |
| 2005 | 1 | 2 |
| 2006 | 2 | 5 |
| 2007 | 3 | 1 |
| 2008 | 2 | 4 |
| 2009 | 1 | 4 |
| 2010 | 1 | 7 |
| 2011 | 3 | 11 |
| 2012 | 5 | 25 |
| 2013 | 16 | 38 |
| 2014 | 21 | 44 |
| 2015 | 43 | 68 |
| 2016 | 50 | 64 |
| 2017 | 56 | 47 |
| 2018 | 49 | 55 |
| 2019 | 50 | 76 |
| 2020 | 69 | 90 |
| 2021 | 35 | 59 |
| 2022 | 59 | 44 |
| 2023 | 51 | 29 |
| 2024 | 34 | 37 |
| 2025 | 23 | 32 |
| 2026 | 19 | 25 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Adhesive dispense unit25 Aug 2026US 12,721,090 B2Nexperia B. V.
- Energy augmentation structures for use with energy emitters and collectors11 Aug 2026US 12,702,861 B2Immunolight, LLC
- Electronic assembly having a power semiconductor component between two circuit carriers, and method for producing same11 Aug 2026US 12,707,570 B2Robert Bosch GmbH
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
- Method of manufacturing a plurality of semiconductor devices as well as a corresponding semiconductor device24 Sep 2026US 2026/0293703 A1Nexperia B. V.
- Sintering film frames and related methods24 Sep 2026US 2026/0293736 A1Semiconductor Components Industries, LLC
- Thermally conductive sheet and method for manufacturing same17 Sep 2026US 2026/0282904 A1Sekisui Chemical Co., Ltd.
Most cited
By later US patents
- Laser assisted transfer welding process144US 9,161,448 B2Semprius, Inc. · 2015
- Electrically bonded arrays of transfer printed active components67US 9,049,797 B2Semprius, Inc. · 2015
- System in package fan out stacking architecture and process flow46US 9,633,974 B2Apple Inc. · 2017
- Method and apparatus for forming an underfill adhesive layer39US 6,352,881 B1National Semiconductor Corporation · 2002
- Method of fabricating semiconductor chip package using screen printing of epoxy on wafer36US 6,943,061 B1NS Electronics Bangkok (1993) Ltd. · 2005