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US 9,633,974 B2Granted
System in package fan out stacking architecture and process flow
AssigneeApple Inc.
InventorsJun Zhai, Kunzhong Hu, Kwan-Yu Lai, Mengzhi Pang, Chonghua Zhong, Se Young Yang
Life of this patent
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Abstract
Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), and a plurality of die attached to the front and back side of the first RDL. The first and second RDLs are coupled together with a plurality of conductive pillars extending from the back side of the first RDL to a front side of the second RDL.
Claims16
A package comprising:
- a first die including a bottom surface that includes a first contact pad and a passivation layer;
- a first redistribution layer (RDL);
- wherein the first die is attached to a front side of the first RDL such that the front side of the first RDL is directly on the first contact pad and the passivation layer;
- a first molding compound encapsulating the first die on the front side of the first RDL;
- a top surface of a second die attached to a back side of the first RDL with a die attach film such that the second die is facing back to the first RDL;
- a second RDL;
- a plurality of conductive pillars extending from the back side of the first RDL to a front side of the second RDL;
- a second molding compound encapsulating the second die and the plurality of conductive pillars between the back side of the first RDL and the front side of the second RDL.
5 more elements
A package comprising:
- a first element including a bottom surface that includes a first contact pad and a passivation layer;
- a first redistribution layer (RDL);
- wherein the first element is attached to a front side of the first RDL such that the front side of the first RDL is directly on the first contact pad and the passivation layer;
- a first molding compound encapsulating the first element on the front side of the first RDL;
- a top surface of a second die attached to a back side of the first RDL with a die attach film such that the second die is facing back to the first RDL;
- a second RDL;
- a plurality of conductive pillars extending from the back side of the first RDL to a front side of the second RDL;
- a second molding compound encapsulating the second die and the plurality of conductive pillars between the back side of the first RDL and the front side of the second RDL.
5 more elements
Dependencies are inferred from the claim text.