H10W 72/01331
Using blanket deposition
Official title: {using blanket deposition}
H10W72/01331 (Using blanket deposition) appears on 1,780 US grants and 2,086 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,780
- Published applications
- 2,086
- Assignees
- 510
- Inventors
- 3,290
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 7 | 0 |
| 1993 | 1 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 16 | 0 |
| 1999 | 23 | 0 |
| 2000 | 20 | 0 |
| 2001 | 38 | 23 |
| 2002 | 39 | 82 |
| 2003 | 51 | 53 |
| 2004 | 60 | 67 |
| 2005 | 62 | 109 |
| 2006 | 60 | 75 |
| 2007 | 56 | 106 |
| 2008 | 52 | 97 |
| 2009 | 59 | 95 |
| 2010 | 96 | 106 |
| 2011 | 94 | 88 |
| 2012 | 68 | 91 |
| 2013 | 80 | 85 |
| 2014 | 68 | 89 |
| 2015 | 83 | 103 |
| 2016 | 71 | 91 |
| 2017 | 86 | 82 |
| 2018 | 74 | 74 |
| 2019 | 74 | 95 |
| 2020 | 82 | 117 |
| 2021 | 61 | 89 |
| 2022 | 76 | 79 |
| 2023 | 68 | 49 |
| 2024 | 54 | 65 |
| 2025 | 41 | 44 |
| 2026 | 24 | 32 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
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- Semiconductor device and method of die attach with adhesive layer containing graphene-coated core11 Aug 2026US 12,708,038 B2STATS ChipPAC Pte. Ltd.
- Tantalum doped ruthenium layers for interconnects4 Aug 2026US 12,701,989 B2APPLIED Materials.Inc.
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and method of manufacturing the semiconductor package1 Oct 2026US 2026/0305403 A1Samsung Electronics Co., Ltd.
- Memory-only cubes and methods of forming the same1 Oct 2026US 2026/0305497 A1Micron Technology, Inc.
- Sintering film frames and related methods24 Sep 2026US 2026/0293736 A1Semiconductor Components Industries, LLC
- Semiconductor package27 Aug 2026US 2026/0256007 A1Electronics and Telecommunications Research Institute
Most cited
By later US patents
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies, methods of making same and components for same424US 5,679,977 ATessera, Inc. · 1997
- Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby412US 6,423,570 B1Intel Corporation · 2002
- Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby382US 6,902,950 B2Intel Corporation · 2005