H10W 72/01333
In liquid form
Official title: {in liquid form, e.g. spin coating, spray coating or immersion coating}
H10W72/01333 (In liquid form) appears on 437 US grants and 576 published applications in this corpus.
Search patents in H10W- Granted patents
- 437
- Published applications
- 576
- Assignees
- 216
- Inventors
- 1,081
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 2 |
| 2006 | 0 | 3 |
| 2007 | 2 | 2 |
| 2008 | 1 | 5 |
| 2009 | 3 | 7 |
| 2010 | 3 | 13 |
| 2011 | 6 | 10 |
| 2012 | 13 | 28 |
| 2013 | 15 | 28 |
| 2014 | 17 | 44 |
| 2015 | 37 | 55 |
| 2016 | 42 | 39 |
| 2017 | 43 | 43 |
| 2018 | 35 | 38 |
| 2019 | 32 | 42 |
| 2020 | 46 | 58 |
| 2021 | 29 | 37 |
| 2022 | 33 | 28 |
| 2023 | 31 | 25 |
| 2024 | 21 | 31 |
| 2025 | 18 | 27 |
| 2026 | 10 | 10 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Semiconductor device and method for manufacturing the semiconductor device28 Jul 2026US 12,696,825 B2Denso Corporation
- Semiconductor package and method of manufacturing the semiconductor package7 Jul 2026US 12,677,679 B2Samsung Electronics Co., Ltd.
- Method for using a buffer sheet23 Jun 2026US 12,662,590 B2Resonac Corporation
- Sintering film frames and related methods16 Jun 2026US 12,660,668 B2Semiconductor Components Industries, LLC
- Semiconductor package and method of manufacturing the semiconductor package1 Oct 2026US 2026/0305403 A1Samsung Electronics Co., Ltd.
- Memory-only cubes and methods of forming the same1 Oct 2026US 2026/0305497 A1Micron Technology, Inc.
- Sintering film frames and related methods24 Sep 2026US 2026/0293736 A1Semiconductor Components Industries, LLC
- Method of Forming an Interconnection between an Electric Component and an Electronic Component4 Jun 2026US 2026/0157209 A1Infineon Technologies Austria AG
- Curable organopolysiloxane composition and semiconductor device14 May 2026US 2026/0136980 A1Shin-Etsu Chemical Co., Ltd.
Most cited
By later US patents
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Chemical mechanical polishing for hybrid bonding165US 10,840,205 B2Invensas Bonding Technologies, Inc. · 2020
- Metal to metal bonding for stacked (3D) integrated circuits82US 8,916,448 B2International Business Machines Corporation · 2014
- Nanowire bonding interconnect for fine-pitch microelectronics61US 11,387,202 B2Invensas Corporation · 2022
- Flexible display and method of formation with sacrificial release layer60US 9,318,475 B2LuxVue Technology Corporation · 2016