Method for using a buffer sheet
AssigneeResonac Corporation
InventorsYuta Koseki, Daisuke Fujimoto, Kumpei Yamada, Naoya Suzuki, Hitoshi Onozeki, Hiroshi Takahashi
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Abstract
The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.
Claims11
A method of producing an electronic component device, the method comprising:
- providing an electronic component and a substrate, wherein the electronic component has a surface facing the substrate, the substrate has a surface facing the electronic component, and solder bumps are formed on one of said surfaces;
- applying a curable underfill material to one or both of the electronic component surface facing the substrate and the substrate surface facing the electronic component;
- applying pressure to the electronic component and the substrate with the solder bumps interposed between the electronic component and the substrate, so that a gap between the electronic component and the substrate is filled with the curable underfill material;
- providing a buffer sheet comprising a dried layer of a curable thermosetting composition, wherein the curable thermosetting composition comprises at least one thermosetting compound;
- interposing the buffer sheet between a heating member and the electronic component;
- and
- subsequently curing the dried layer of the buffer sheet and the curable underfill material with heat from the heating member.
Dependencies are inferred from the claim text.