Curable organopolysiloxane composition and semiconductor device

Abstract

Provided is a curable organopolysiloxane composition containing a thermally conductive material that is uniformly dispersed in the state of fine particles in a matrix comprised of a resin component, where the composition can then be turned into a cured product exhibiting no cracks or voids when the product is cured. The composition contains (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups per each molecule, said organopolysiloxane being liquid at 25° C., (B) an organohydrogenpolysiloxane having a silicon atom-bonded hydrogen atom, (C) gallium and/or a gallium alloy having a melting point of −20 to 70° C., (D) a thermally conductive filler having an average particle diameter of 0.1 to 30 m, and (E) a platinum group metal catalyst, wherein the gallium and/or the gallium alloy (C) is in the form of particles dispersed in the organopolysiloxane and exhibits a solidifying point of −40° C. or lower.

Dependencies are inferred from the claim text.