H10W 72/01335
By plating
Official title: {by plating, e.g. electroless plating or electroplating}
H10W72/01335 (By plating) appears on 198 US grants and 253 published applications in this corpus.
Search patents in H10W- Granted patents
- 198
- Published applications
- 253
- Assignees
- 107
- Inventors
- 411
- Latest grant
- 17 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 2 |
| 2009 | 2 | 2 |
| 2010 | 0 | 1 |
| 2011 | 2 | 4 |
| 2012 | 2 | 12 |
| 2013 | 7 | 9 |
| 2014 | 9 | 22 |
| 2015 | 15 | 21 |
| 2016 | 19 | 23 |
| 2017 | 22 | 23 |
| 2018 | 19 | 16 |
| 2019 | 15 | 19 |
| 2020 | 24 | 28 |
| 2021 | 17 | 14 |
| 2022 | 15 | 11 |
| 2023 | 10 | 11 |
| 2024 | 11 | 16 |
| 2025 | 6 | 15 |
| 2026 | 3 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method of forming an interconnection between an electric component and an electronic component17 Mar 2026US 12,581,981 B2Infineon Technologies Austria AG
- Dam for three-dimensional integrated circuit3 Mar 2026US 12,568,849 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Roll to roll sintering system for wide inorganic tape material and sintered articles27 Jan 2026US 12,537,225 B2Corning Incorporated
- Semiconductor device and method of manufacturing semiconductor device16 Dec 2025US 12,500,129 B2Rohm Co., Ltd.
- Method for manufacturing an electronic power module9 Dec 2025US 12,494,378 B2Safran
- Method of Forming an Interconnection between an Electric Component and an Electronic Component4 Jun 2026US 2026/0157209 A1Infineon Technologies Austria AG
- Semiconductor Device and Connecting Method26 Feb 2026US 2026/0060098 A1Waseda University
- Semiconductor device and method of manufacturing semiconductor device29 Jan 2026US 2026/0033371 A1Rohm Co., Ltd.
- Electronic device and solder reflow-less process25 Dec 2025US 2025/0391800 A1Texas Instruments Incorporated
- Bonding arrangement having a metal inverse opals layer27 Nov 2025US 2025/0364484 A1Purdue Research Foundation
Most cited
By later US patents
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Chemical mechanical polishing for hybrid bonding165US 10,840,205 B2Invensas Bonding Technologies, Inc. · 2020
- Metal to metal bonding for stacked (3D) integrated circuits82US 8,916,448 B2International Business Machines Corporation · 2014
- Nanowire bonding interconnect for fine-pitch microelectronics61US 11,387,202 B2Invensas Corporation · 2022
- Flexible display and method of formation with sacrificial release layer60US 9,318,475 B2LuxVue Technology Corporation · 2016