Semiconductor device and method of manufacturing semiconductor device
AssigneeRohm Co., Ltd.
InventorSatoshi Kageyama
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Abstract
A semiconductor device includes: a conductive portion; and a semiconductor element mounted on the conductive portion, wherein the conductive portion is made of a plating layer, wherein the conductive portion includes a mounting portion having a mounting surface on which the semiconductor element is mounted, and a terminal portion extending to an opposite side of the semiconductor element with respect to the mounting portion, wherein the mounting portion extends in a first direction along the mounting surface more than the terminal portion, and wherein the mounting portion and the terminal portion are integrally formed.
Claims11
A semiconductor device comprising:
- a conductive portion;
- and
- a semiconductor element mounted on the conductive portion,
- wherein the conductive portion is made of a plating layer,
- wherein the conductive portion includes a mounting portion having a mounting surface on which the semiconductor element is mounted, and a terminal portion extending from the mounting portion toward a direction opposite to the semiconductor element,
- wherein the mounting portion extends in a first direction along the mounting surface more than the terminal portion, and
- wherein the mounting portion and the terminal portion are integrally formed without an interface formed therebetween.
A method of manufacturing a semiconductor device, which includes a conductive portion and a semiconductor element mounted on the conductive portion, wherein the conductive portion includes a mounting portion having a mounting surface on which the semiconductor element is mounted, and a terminal portion extending from the mounting portion toward a direction opposite to the semiconductor element, the method comprising:
- integrally forming the mounting portion and the terminal portion by a plating layer.
Dependencies are inferred from the claim text.