H10W 72/01336
In solid form
Official title: {in solid form, e.g. by using a powder or by laminating a foil}
H10W72/01336 (In solid form) appears on 488 US grants and 622 published applications in this corpus.
Search patents in H10W- Granted patents
- 488
- Published applications
- 622
- Assignees
- 204
- Inventors
- 1,182
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 1 |
| 2002 | 1 | 3 |
| 2003 | 5 | 6 |
| 2004 | 4 | 3 |
| 2005 | 5 | 10 |
| 2006 | 4 | 4 |
| 2007 | 1 | 7 |
| 2008 | 1 | 6 |
| 2009 | 6 | 11 |
| 2010 | 6 | 21 |
| 2011 | 13 | 28 |
| 2012 | 12 | 34 |
| 2013 | 23 | 40 |
| 2014 | 22 | 32 |
| 2015 | 34 | 39 |
| 2016 | 23 | 42 |
| 2017 | 41 | 35 |
| 2018 | 31 | 30 |
| 2019 | 38 | 47 |
| 2020 | 34 | 63 |
| 2021 | 28 | 48 |
| 2022 | 42 | 42 |
| 2023 | 32 | 21 |
| 2024 | 32 | 28 |
| 2025 | 22 | 10 |
| 2026 | 10 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Integrated dicing die bonding sheet and method for producing semiconductor device25 Aug 2026US 12,721,105 B2Dow Toray Co., Ltd.
- Electronic assembly having a power semiconductor component between two circuit carriers, and method for producing same11 Aug 2026US 12,707,570 B2Robert Bosch GmbH
- Semiconductor device and method for manufacturing the semiconductor device28 Jul 2026US 12,696,825 B2Denso Corporation
- Method for using a buffer sheet23 Jun 2026US 12,662,590 B2Resonac Corporation
- Sintering film frames and related methods24 Sep 2026US 2026/0293736 A1Semiconductor Components Industries, LLC
- Semiconductor die bonding structure and methods of forming the same6 Aug 2026US 2026/0231789 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Bonding film, semiconductor module, inverter, electronic device, and method for manufacturing semiconductor module30 Jul 2026US 2026/0223716 A1Furukawa Electric Co., Ltd.
- Hot melt curable silicone composition, layered product using said composition, and method for producing semiconductor device23 Jul 2026US 2026/0215318 A1Dow Toray Co., Ltd.
- Semiconductor package including an integrated circuit die and an inductor or a transformer9 Jul 2026US 2026/0198021 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Semiconductor flip-chip assembly with pre-applied encapsulating layers169US 6,297,560 B12001
- Semiconductor flip-chip package and method for the fabrication thereof141US 6,121,689 AMiguel Albert Capote · 2000
- Assembly aid for mounting packaged integrated circuit devices to printed circuit boards133US 6,084,781 AMicron Electronics, Inc. · 2000
- Electrically and thermally conductive adhesive transfer tape128US 4,606,962 AMinnesota Mining and Manufacturing Company · 1986
- Semiconductor flip-chip package and method for the fabrication thereof101US 6,518,677 B12003