Semiconductor die bonding structure and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTzu Jung Tien, Jen-Yuan Chang
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Abstract
An adhesive bonding structure and methods for forming the same. In some embodiments, a semiconductor device includes an interposer, and a plurality of dies attached to the interposer. In some embodiments, the plurality of dies includes at least one dummy die, and one semiconductor die. In some embodiments, the dummy die is attached to the top surface of the interposer by an adhesive layer. In some embodiments, the semiconductor device further includes a molding compound surrounding the plurality of dies.
Claims20
A semiconductor device, comprising:
- an interposer having a top surface;
- an adhesive material;
- and
- a die having a bottom surface bonded to the top surface of the interposer via the adhesive material, wherein the adhesive material substantially fills any gap between the top surface of the interposer and the bottom surface of the die.
A semiconductor device, comprising:
- an interposer;
- a semiconductor die attached to a top surface of the interposer;
- a dummy die attached to the top surface of the interposer;
- an adhesive layer located between the top surface of the interposer and a bottom surface of the dummy die;
- and
- a molding compound surrounding the semiconductor die and the dummy die.
A method for forming a semiconductor device, the method comprising:
- forming an interposer;
- applying an adhesive layer on a portion of a top surface of the interposer;
- attaching a die to the portion of the top surface of the interposer via the adhesive layer;
- and
- flowing an additional amount of adhesive between the portion of the top surface of the interposer and the die to fill in a gap between the top surface of the interposer and the die.
Dependencies are inferred from the claim text.