Assembly aid for mounting packaged integrated circuit devices to printed circuit boards

An assembly aid for mounting an integrated circuit device having a plurality of leads to a circuit board, comprising:

• a plurality of solidified solder elements, said elements being shaped to receive respective ones of said leads;
• a mounting substrate having at least a first layer and a second layer;
• said first layer having a plurality of first apertures substantially corresponding to the location of said leads, said first apertures further being sized to receive said solidified solder elements therein, said second layer having a plurality of second apertures substantially corresponding to the location of said first apertures, said second apertures being sized so as to prevent said solder elements from passing through said second apertures;
• and
• an adhesive layer communicating with said first mounting substrate layer so as to retain said solder elements substantially within said first apertures.

A circuit board having an integrated circuit device with connecting leads, assembled by a process comprising the steps of:

• providing a mounting substrate having a plurality of first and second apertures, the relative positions of both said first and second apertures corresponding to those of the connecting leads of the integrated circuit device, said second apertures having a smaller diameter than said first apertures and communicating therewith;
• locating solder material substantially upon said mounting substrate such that said solder material communicates with selected first apertures of said substrate,
• applying an adhesive layer to said mounting substrate such that said solder material is retained substantially within said first apertures;
• attaching said mounting substrate to said circuit board;
• positioning the integrated circuit device adjacent to said mounting substrate such that the connecting leads of the integrated circuit communicate with said first apertures and said solder material, so as to form an assembly;
• and
• heating said assembly so as to melt said solder material to form an electrical contact between said integrated circuit and said circuit board.

A computer system having a circuit board, said circuit board having an integrated circuit device with connecting leads and being assembled by a process comprising the steps of:

• providing a mounting substrate having a first and second layer in substantial communication with each other, said first layer having a plurality of first apertures whose relative positions on said substrate correspond to those of the connecting leads of said integrated circuit device, said second layer having a plurality of second apertures of smaller diameter than said first apertures and communicating substantially therewith;
• locating solidified solder elements substantially within said mounting substrate such that said solder elements communicate with respective first apertures of said first substrate layer;
• applying an adhesive layer to said mounting substrate such that said solder elements are retained substantially within said first apertures;
• attaching said mounting substrate to said circuit board;
• positioning the integrated circuit device adjacent to said mounting substrate such that the connecting leads of the integrated circuit communicate with said first apertures and said solder elements, so as to form an assembly;
• and
• heating said assembly so as to at least partially melt said solder elements to form an electrical contact between said integrated circuit and said circuit board.

A circuit board having an integrated circuit device with connecting leads, prepared by a process comprising the steps of:

• providing a mounting substrate having a plurality of first and second apertures, the relative locations of both of said first and second apertures corresponding to that of the connecting leads of the integrated circuit device, said second apertures having a smaller diameter than said first apertures and communicating therewith;
• attaching said mounting substrate to said circuit board via a first adhesive layer;
• locating solder material substantially within said mounting substrate such that said solder material communicates with selected first apertures of said substrate,
• applying a second adhesive layer to said mounting substrate such that said solder material is retained substantially within said first apertures;
• positioning the integrated circuit device adjacent to said mounting substrate such that the connecting leads of the integrated circuit communicate with said first apertures and said solder material, so as to form an assembly;
• and
• heating said assembly so as to melt said solder material to form an electrical contact between said integrated circuit and said circuit board.