Hot melt curable silicone composition, layered product using said composition, and method for producing semiconductor device

A curable silicone composition comprising:

• (A) an organopolysiloxane resin containing a component (A1) and a component (A2) below at a mass ratio of 0:100 to 90:10:
• (A1) an organopolysiloxane resin having no hot-melt properties as a whole molecule, having a curing reactive functional group containing a carbon-carbon double bond in the molecule, and containing a siloxane unit represented by SiO4/2 making up at least 20 mol % or more of the total siloxane units, and
• (A2) an organopolysiloxane resin having no hot-melt properties as a whole molecule, having a curing reactive functional group containing at least one carbon-carbon double bond in the molecule, and containing at least 20 mol % or more of the total siloxane units represented by SiO4/2;
• (B) a straight-chain or branched-chain organopolysiloxane, liquid at 25° C., having a curing reactive functional group containing at least two carbon-carbon double bonds in the molecule;
• (C) one or more curing agents selected from (c1) or (c2) below, in an amount necessary to cure the composition:
• (c1) an organic peroxide;
• and
• (c2) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule and a hydrosilylation reaction catalyst;
• and
• (D) aerosol silica;
• and having hot-melt properties for the composition as a whole;
• wherein a mass ratio of the component (A) to the component (B) (=(A)/(B)) is in a range of 2.50 to 3.00, and a content of the component (D) contained in a total amount of the components (A) to (D) is in a range of 2.0 to 10 mass %.