H10W 72/01371
Cleaning
Official title: {Cleaning, e.g. oxide removal or de-smearing}
H10W72/01371 (Cleaning) appears on 208 US grants and 278 published applications in this corpus.
Search patents in H10W- Granted patents
- 208
- Published applications
- 278
- Assignees
- 116
- Inventors
- 496
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 2 |
| 2003 | 0 | 1 |
| 2004 | 0 | 2 |
| 2005 | 2 | 1 |
| 2006 | 4 | 3 |
| 2007 | 1 | 3 |
| 2008 | 3 | 7 |
| 2009 | 1 | 2 |
| 2010 | 1 | 1 |
| 2011 | 2 | 3 |
| 2012 | 1 | 17 |
| 2013 | 7 | 6 |
| 2014 | 5 | 12 |
| 2015 | 10 | 21 |
| 2016 | 15 | 20 |
| 2017 | 18 | 17 |
| 2018 | 18 | 27 |
| 2019 | 17 | 15 |
| 2020 | 25 | 22 |
| 2021 | 17 | 25 |
| 2022 | 14 | 17 |
| 2023 | 15 | 18 |
| 2024 | 16 | 14 |
| 2025 | 7 | 15 |
| 2026 | 9 | 7 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Cleaning liquid and method for manufacturing semiconductor device8 Sep 2026US 12,729,348 B2Kabushiki Kaisha Toshiba
- Manufacturing method for semiconductor device8 Sep 2026US 12,733,528 B2Fuji Electric Co., Ltd.
- Package with solder mask1 Sep 2026US 12,727,487 B2NXP USA, Inc.
- Self-aligning bonding by hydrophilic contrast2 Jun 2026US 12,648,475 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Method for attaching a first connection partner to a second connection partner5 May 2026US 12,617,046 B2Infineon Technologies AG
- Methods and apparatus for substrate processing4 Jun 2026US 2026/0157176 A1APPLIED Materials.Inc.
- Method of Forming an Interconnection between an Electric Component and an Electronic Component4 Jun 2026US 2026/0157209 A1Infineon Technologies Austria AG
- Semiconductor devices and method for forming the same14 May 2026US 2026/0136931 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Techniques for processing devices5 Mar 2026US 2026/0068765 A1Adeia Semiconductor Bonding Technologies Inc.
- High bandwidth memory and method for manufacturing the same12 Feb 2026US 2026/0047490 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Three dimensional device integration method and integrated device220US 7,126,212 B2Ziptronix, Inc. · 2006
- Method for low temperature bonding and bonded structure200US 9,331,149 B2Ziptronix, Inc. · 2016
- Three dimensional device integration method and integrated device194US 9,431,368 B2Ziptronix, Inc. · 2016
- Method for low temperature bonding and bonded structure175US 6,902,987 B1Ziptronix, Inc. · 2005