H10W 72/01351
Changing the shapes of die-attach connectors
Official title: {Changing the shapes of die-attach connectors}
H10W72/01351 (Changing the shapes of die-attach connectors) appears on 550 US grants and 730 published applications in this corpus.
Search patents in H10W- Granted patents
- 550
- Published applications
- 730
- Assignees
- 233
- Inventors
- 1,391
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 4 |
| 2003 | 2 | 5 |
| 2004 | 4 | 3 |
| 2005 | 4 | 5 |
| 2006 | 6 | 4 |
| 2007 | 2 | 2 |
| 2008 | 4 | 8 |
| 2009 | 4 | 11 |
| 2010 | 7 | 9 |
| 2011 | 6 | 5 |
| 2012 | 8 | 26 |
| 2013 | 19 | 18 |
| 2014 | 14 | 34 |
| 2015 | 21 | 36 |
| 2016 | 32 | 43 |
| 2017 | 45 | 51 |
| 2018 | 39 | 38 |
| 2019 | 47 | 62 |
| 2020 | 60 | 73 |
| 2021 | 40 | 56 |
| 2022 | 46 | 62 |
| 2023 | 48 | 51 |
| 2024 | 40 | 50 |
| 2025 | 28 | 42 |
| 2026 | 20 | 32 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same29 Sep 2026US 12,751,310 B2Furukawa Electric Co., Ltd.
- Redistribution layer metallic layout structure and method with warpage reduction8 Sep 2026US 12,733,435 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Integration and bonding of micro-devices into system substrate11 Aug 2026US 12,707,781 B2VueReal Inc.
- Semiconductor packages and methods of manufacturing thereof4 Aug 2026US 12,701,939 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Redistribution layer metallic layout structure and method with warpage reduction1 Oct 2026US 2026/0305234 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuits with fusion-bonded diamond substrates for thermal management24 Sep 2026US 2026/0293674 A1Intel Corporation
- Sintering film frames and related methods24 Sep 2026US 2026/0293736 A1Semiconductor Components Industries, LLC
Most cited
By later US patents
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Three dimensional device integration method and integrated device220US 7,126,212 B2Ziptronix, Inc. · 2006
- Method for low temperature bonding and bonded structure200US 9,331,149 B2Ziptronix, Inc. · 2016
- Three dimensional device integration method and integrated device194US 9,431,368 B2Ziptronix, Inc. · 2016
- Method for low temperature bonding and bonded structure175US 6,902,987 B1Ziptronix, Inc. · 2005