H10W 72/01353
By etching
Official title: {by etching}
H10W72/01353 (By etching) appears on 195 US grants and 245 published applications in this corpus.
Search patents in H10W- Granted patents
- 195
- Published applications
- 245
- Assignees
- 95
- Inventors
- 453
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 2 | 2 |
| 2004 | 2 | 1 |
| 2005 | 1 | 2 |
| 2006 | 2 | 1 |
| 2007 | 0 | 1 |
| 2008 | 3 | 2 |
| 2009 | 1 | 3 |
| 2010 | 3 | 5 |
| 2011 | 4 | 2 |
| 2012 | 5 | 10 |
| 2013 | 8 | 6 |
| 2014 | 6 | 12 |
| 2015 | 8 | 14 |
| 2016 | 9 | 18 |
| 2017 | 18 | 13 |
| 2018 | 10 | 12 |
| 2019 | 13 | 18 |
| 2020 | 23 | 28 |
| 2021 | 15 | 15 |
| 2022 | 19 | 19 |
| 2023 | 14 | 15 |
| 2024 | 13 | 23 |
| 2025 | 7 | 10 |
| 2026 | 7 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Redistribution layer metallic layout structure and method with warpage reduction8 Sep 2026US 12,733,435 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integration and bonding of micro-devices into system substrate11 Aug 2026US 12,707,781 B2VueReal Inc.
- Semiconductor packages and methods of manufacturing thereof4 Aug 2026US 12,701,939 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Controlling adhesive reflow for transfer printing21 Jul 2026US 12,690,499 B2Daktronics, Inc.
- Semiconductor device and method of manufacturing3 Mar 2026US 12,568,780 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Redistribution layer metallic layout structure and method with warpage reduction1 Oct 2026US 2026/0305234 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuits with fusion-bonded diamond substrates for thermal management24 Sep 2026US 2026/0293674 A1Intel Corporation
- Modification of ceramic capacitor for mitigation of delamination in memory devices30 Jul 2026US 2026/0221344 A1Micron Technology, Inc.
- Semiconductor device2 Jul 2026US 2026/0190884 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Method for low temperature bonding and bonded structure200US 9,331,149 B2Ziptronix, Inc. · 2016
- Method for low temperature bonding and bonded structure175US 6,902,987 B1Ziptronix, Inc. · 2005
- Processed stacked dies172US 10,879,212 B2Invensas Bonding Technologies, Inc. · 2020
- Bonding surfaces for microelectronics171US 11,056,348 B2Invensas Bonding Technologies, Inc. · 2021