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US 12,707,781 B2Granted
Integration and bonding of micro-devices into system substrate
AssigneeVueReal Inc.
InventorsGholamreza Chaji, Bahareh Sadeghimakki
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Abstract
This disclosure is related to integrating optoelectronics microdevices into a system substrate for efficient and durable electrical bonding between two substrates at low temperature. 2D nanostructures and 3D scaffolds may create interlocking structures for improved bonding properties. Addition of nanoparticles into the structure creates high surface area for better conduction. Application of curing agents before or after alignment of micro devices and receiving substrates further assists with formation of strong bonds.
Claims21
A method of electrically bonding microdevices, the method comprising:
- providing at least one bonding pad on a receiver substrate, and at least one optoelectronic microdevice on a donor substrate;
- texturing at least a portion of a surface of the at least one bonding pad, at least a portion of a surface of the at least one optoelectronic microdevice, or both, to increase a respective surface area, the texturing performed via ion milling, laser ablation, reactive ion etching, dry etching, wet etching, or any combination thereof;
- and
- electrically bonding at least the portion of the surface of the at least one bonding pad to at least the portion of the surface of the at least one optoelectronic microdevice.
1 more element
Dependencies are inferred from the claim text.