H10W 72/01355
By use of masks
Official title: {by use of masks}
H10W72/01355 (By use of masks) appears on 59 US grants and 76 published applications in this corpus.
Search patents in H10W- Granted patents
- 59
- Published applications
- 76
- Assignees
- 38
- Inventors
- 151
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 2 | 5 |
| 2013 | 1 | 0 |
| 2014 | 1 | 3 |
| 2015 | 1 | 2 |
| 2016 | 2 | 2 |
| 2017 | 4 | 6 |
| 2018 | 5 | 5 |
| 2019 | 10 | 9 |
| 2020 | 7 | 8 |
| 2021 | 2 | 6 |
| 2022 | 9 | 8 |
| 2023 | 6 | 5 |
| 2024 | 3 | 10 |
| 2025 | 2 | 3 |
| 2026 | 4 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Redistribution layer metallic layout structure and method with warpage reduction8 Sep 2026US 12,733,435 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Dam for three-dimensional integrated circuit3 Mar 2026US 12,568,849 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for fabricating a semiconductor device using wet etching and dry etching and semiconductor device13 Jan 2026US 12,525,555 B2Infineon Technologies Austria AG
- Fingerprint sensor and manufacturing method thereof7 Oct 2025US 12,438,110 B2Amkor Technology Singapore Holding Pte.Ltd.
- Redistribution layer metallic layout structure and method with warpage reduction1 Oct 2026US 2026/0305234 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure including bonding part with heat-dissipating unit and method for manufacturing the same26 Mar 2026US 2026/0090373 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer-to-wafer bonding structure and fabrication method thereof19 Feb 2026US 2026/0052995 A1United Microelectronics Corp.
- Semiconductor device and method of forming the same7 Aug 2025US 2025/0253277 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of fabricating a semiconductor chip5 Jun 2025US 2025/0183225 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Printed components on substrate posts19US 10,790,173 B2X Display Company Technology Limited · 2020
- Bondable device including a hydrophilic layer14US 9,773,741 B1QUALCOMM Incorporated · 2017
- Semiconductor device package and manufacturing method thereof8US 10,283,400 B1Amkor Technology, Inc. · 2019
- Semiconductor device package and manufacturing method thereof8US 9,966,300 B1Amkor Technology, Inc. · 2018
- Adhesive bonding composition and method of use7US 10,410,991 B2Immunolight, LLC · 2019