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AssigneeAmkor Technology, Inc.
InventorsMichael G. Kelly, Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner
Estimating the term…
Methods and systems for a semiconductor device package with a die to interposer wafer first bond are disclosed and may include bonding a plurality of semiconductor die comprising electronic devices to an interposer wafer, and applying an underfill material between the die and the interposer wafer. Methods and systems for a semiconductor device package with a die-to-packing substrate first bond are disclosed and may include bonding a first semiconductor die to a packaging substrate, applying an underfill material between the first semiconductor die and the packaging substrate, and bonding one or more additional die to the first semiconductor die. Methods and systems for a semiconductor device package with a die-to-die first bond are disclosed and may include bonding one or more semiconductor die comprising electronic devices to an interposer die.
A method for making a semiconductor package, the method comprising:
A method for making a semiconductor package, the method comprising:
A method for making a semiconductor package, the method comprising:
Dependencies are inferred from the claim text.