H10W 72/01357
By reflowing or heating
Official title: {by reflowing or heating}
H10W72/01357 (By reflowing or heating) appears on 60 US grants and 77 published applications in this corpus.
Search patents in H10W- Granted patents
- 60
- Published applications
- 77
- Assignees
- 48
- Inventors
- 191
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 1 |
| 2016 | 0 | 3 |
| 2017 | 5 | 8 |
| 2018 | 3 | 6 |
| 2019 | 11 | 11 |
| 2020 | 8 | 5 |
| 2021 | 2 | 8 |
| 2022 | 9 | 9 |
| 2023 | 3 | 4 |
| 2024 | 6 | 3 |
| 2025 | 4 | 10 |
| 2026 | 3 | 4 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same29 Sep 2026US 12,751,310 B2Furukawa Electric Co., Ltd.
- Controlling adhesive reflow for transfer printing21 Jul 2026US 12,690,499 B2Daktronics, Inc.
- Semiconductor device17 Mar 2026US 12,581,969 B2Denso Corporation
- Electronic device and display device using the same23 Dec 2025US 12,506,107 B2LG Display Co., Ltd.
- Hybrid backside thermal structures for enhanced ic packages25 Nov 2025US 12,482,779 B2Intel Corporation
- Thermally conductive sheet and method for manufacturing same17 Sep 2026US 2026/0282904 A1Sekisui Chemical Co., Ltd.
- Semiconductor device and method for fabricating the same2 Jul 2026US 2026/0191036 A1Intel Corporation
- Electronic device having a substrate employing reduced area, added metal pad(s) to metal interconnect(s) to reduce air voids in solder joints23 Apr 2026US 2026/0114298 A1QUALCOMM Incorporated
- Land-side die cooling of double-sided package substrates1 Jan 2026US 2026/0005180 A1Intel Corporation
- Semiconductor device with controlled bond line thickness using spacers and recesses30 Oct 2025US 2025/0336776 A1Nexperia B. V.
Most cited
By later US patents
- Method and apparatus for forming an underfill adhesive layer39US 6,352,881 B1National Semiconductor Corporation · 2002
- 3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix23US 9,871,014 B2Invensas Corporation · 2018
- Method and apparatus for forming an underfill adhesive layer19US 7,253,078 B1National Semiconductor Corporation · 2007
- Three dimensional fully molded power electronics module having a plurality of spacers for high power applications12US 9,704,819 B1Hong Kong Applied Science and Technology Research Institute Company Limited · 2017
- Semiconductor package having thermal interface material (TIM)10US 6,756,668 B2Samsung Electronics Co., Ltd. · 2004