Semiconductor package having thermal interface material (TIM)
AssigneeSamsung Electronics Co., Ltd.
InventorsJoong-Hyun Baek, Ho-Jeong Moon, Dong-Kil Shin, Yun-Hyeok Im
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Abstract
A semiconductor package and a method for forming the same are provided. The semiconductor package comprises a chip having an active surface and a back surface. The semiconductor package further comprises a substrate having an upper surface and a lower surface opposite the upper surface. The chip is electrically connected to the upper surface of the substrate. A lid is thermally coupled to the back surface of the chip. A thermal interface material (TIM) is located between the chip and the lid. The TIM includes voids to reduce thermomechanical stresses applied on the chip and the TIM, thereby preventing package cracks.
Claims15
A semiconductor package, comprising:
- a chip having an active surface and a back surface, the chip having a plurality of electrode bumps formed on the active surface;
- a substrate having an upper surface and a lower surface opposite the upper surface, the chip being flip-chip bonded to the upper surface of the substrate;
- external connection terminals extending from the lower surface of the substrate and electrically connected to the chip;
- a lid thermally coupled to the back surface of the chip for emitting heat generated from the chip;
- and
- a thermal interface material (TIM) located between the chip and the lid for transmitting heat generated from the chip to the lid, the TIM including voids arranged at uniform distances from each other.
A semiconductor package, comprising:
- a chip having an active surface and a back surface;
- a substrate having an upper surface and a lower surface opposite the upper surface, the chip being electrically connected to the upper surface of the substrate;
- a lid thermally coupled to the back surface of the chip;
- and
- a TIM located between the chip and the lid, wherein the TIM includes voids,
- wherein the voids are formed alone a perimeter of the chip at substantially uniform distances from each other.
Dependencies are inferred from the claim text.