Semiconductor device
AssigneeDenso Corporation
InventorsTakuya Kadoguchi, Takanori Kawashima, Shinji Hiramitsu, Shoichiro Omae
Life of this patent
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Abstract
A semiconductor device includes a semiconductor element having a surface on which a first electrode and a second electrode are disposed, a conductor plate having a surface facing the surface of the semiconductor element and electrically connected to the first electrode, an insulating layer disposed on the surface of the conductor plate and covers a part of the surface of the conductor plate, and a conductor circuit pattern disposed on the insulating layer. The conductor circuit pattern has at least one conductor line electrically connected to the semiconductor element. The at least one conductor line includes a conductor line electrically connected to the second electrode.
Claims20
A semiconductor device comprising:
- a semiconductor element having a first surface on which a first electrode and a second electrode are disposed, and a second surface opposite to the first surface of the semiconductor element;
- a first conductor plate having a first surface facing the first surface of the semiconductor element and electrically connected to the first electrode of the semiconductor element, and a second surface opposite to the first surface of the first conductor plate;
- a first insulating layer disposed on the first surface of the first conductor plate and covering a part of the first surface of the first conductor plate;
- a conductor circuit pattern disposed on the first insulating layer;
- a second conductor plate having a first surface facing the second surface of the semiconductor element, and a second surface opposite to the first surface of the second conductor plate;
- a second insulating layer disposed on the first surface of the second conductor plate and covering a part of the first surface of the second conductor plate;
- a connection terminal;
- and
- a spacer formed integrally with or separated from the connection terminal, wherein
- the conductor circuit pattern has at least one conductor line electrically connected to the semiconductor element,
- the at least one conductor line includes a conductor line electrically connected to the second electrode,
- the semiconductor element further includes a third electrode disposed on the second surface of the semiconductor element, and electrically connected to the first surface of the second conductor plate,
- the connection terminal is electrically connected to the at least one conductor line,
- one end portion of the connection terminal is located between the at least one conductor line and the second insulating layer and is bonded to the at least one conductor line,
- the spacer includes:
- a first convex portion protruding from the one end portion of the connection terminal toward the at least one conductor line;
- and
- a second convex portion protruding from a position opposite to the first convex portion at the one end portion of the connection terminal toward the second insulating layer, and
- the spacer is disposed between the one end portion of the connection terminal and the second insulating layer.
Dependencies are inferred from the claim text.