Method for manufacturing a 2.5D/3D electronic packaging structure by embedding a wafer into a cavity of a glass substrate

A method for manufacturing a 2.5D/3D electronic packaging structure, comprising:

• forming a die-silicon-bridge interconnect structure, comprising:
• disposing a metal array over a silicon wafer, fixing a first die and a second die to the metal array over the silicon wafer so as to electrically connect the first and the second dies, wherein a bottom surface of the first die and a bottom surface of the second die face the silicon wafer respectively;
• removing a portion of the silicon wafer to partially expose the bottom surfaces of the first die and the second die;
• forming a glass substrate as a carrier, comprising:
• forming a cavity on a surface of the glass substrate;
• embedding the silicon wafer with the metal array into the cavity in the glass substrate;
• forming vias in the glass substrate at outsides of the cavity, wherein the vias extend through the glass substrate, and filling the vias with metal materials to form metal pillars;
• forming first solder pads, wherein each of first solder pads is disposed at a first end of one of the metal pillars, and forming second solder pads, wherein each of second solder pads is disposed at a second end of said metal pillars;
• forming a die lead-out, comprising:
• connecting the first solder pads of the metal pillars to the first die and the second die respectively from the outside of the cavity;
• providing an organic substrate;
• and
• connecting the second solder pads to a surface of the organic substrate, so as to connect the first die and the second die to the organic substrate.