H10W 72/016
Of strap connectors
Official title: {of strap connectors}
H10W72/016 (Of strap connectors) appears on 547 US grants and 710 published applications in this corpus.
Search patents in H10W- Granted patents
- 547
- Published applications
- 710
- Assignees
- 237
- Inventors
- 1,297
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 2 |
| 2002 | 3 | 8 |
| 2003 | 2 | 2 |
| 2004 | 5 | 7 |
| 2005 | 2 | 8 |
| 2006 | 4 | 18 |
| 2007 | 12 | 15 |
| 2008 | 2 | 7 |
| 2009 | 7 | 15 |
| 2010 | 9 | 20 |
| 2011 | 18 | 28 |
| 2012 | 16 | 28 |
| 2013 | 25 | 39 |
| 2014 | 25 | 38 |
| 2015 | 33 | 48 |
| 2016 | 44 | 37 |
| 2017 | 49 | 42 |
| 2018 | 20 | 39 |
| 2019 | 30 | 30 |
| 2020 | 36 | 51 |
| 2021 | 48 | 70 |
| 2022 | 31 | 39 |
| 2023 | 42 | 33 |
| 2024 | 23 | 32 |
| 2025 | 31 | 30 |
| 2026 | 16 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for manufacturing semiconductor apparatus and semiconductor apparatus8 Sep 2026US 12,733,511 B2Rohm Co., Ltd.
- Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the method8 Sep 2026US 12,733,527 B2JMJ Korea Co., Ltd.
- Sintered metal flip chip joints18 Aug 2026US 12,713,938 B2Texas Instruments Incorporated
- Handling a fragile substrate for interconnect bonding28 Jul 2026US 12,696,783 B2Asmpt Singapore Pte. Ltd.
- Semiconductor package with a cured electrically conductive paste interconnect and method for producing the same14 Jul 2026US 12,685,209 B2Nexperia B. V.
- Method of manufacturing a plurality of semiconductor devices as well as a corresponding semiconductor device24 Sep 2026US 2026/0293703 A1Nexperia B. V.
- Semiconductor Device and Method of Making Using Dual-Laser Compression Bonding17 Sep 2026US 2026/0282989 A1JCET STATS ChipPAC Korea Limited
- Frame module for a semiconductor integrated circuit, ic, as well as a power module comprising such a frame module and a method of manufacturing such a frame module10 Sep 2026US 2026/0271778 A1Nexperia B. V.
- Method of manufacturing semiconductor devices and corresponding semiconductor device3 Sep 2026US 2026/0262526 A1STMicroelectronics International N. V.
- Bonding systems for bonding a semiconductor element to a substrate, and related methods20 Aug 2026US 2026/0248013 A1Kulicke and Soffa Industries, Inc.
Most cited
By later US patents
- Symmetrical package for semiconductor die208US 6,256,200 B12001
- Structures and methods for low temperature bonding using nanoparticles162US 10,892,246 B2Invensas Corporation · 2021
- Coaxial through chip connection98US 7,157,372 B1Cubic Wafer, Inc. · 2007
- Method of fabricating an electronic circuit device77US 5,865,365 AHitachi, Ltd. · 1999
- Double solder bumps on substrates for low temperature flip chip bonding73US 8,987,132 B2International Business Machines Corporation · 2015