H10W 72/01615
Forming coatings
Official title: {Forming coatings}
H10W72/01615 (Forming coatings) appears on 22 US grants and 32 published applications in this corpus.
Search patents in H10W- Granted patents
- 22
- Published applications
- 32
- Assignees
- 19
- Inventors
- 93
- Latest grant
- 24 Dec 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 2 |
| 2014 | 1 | 3 |
| 2015 | 2 | 1 |
| 2016 | 2 | 2 |
| 2017 | 1 | 2 |
| 2018 | 2 | 3 |
| 2019 | 3 | 3 |
| 2020 | 1 | 3 |
| 2021 | 4 | 4 |
| 2022 | 3 | 2 |
| 2023 | 1 | 0 |
| 2024 | 2 | 2 |
| 2025 | 0 | 2 |
| 2026 | 0 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Electrical connection member, electrical connection structure, and method for manufacturing electrical connection member24 Dec 2024US 12,176,315 B2Hitachi Metals, Ltd.
- Pre-plating of solder layer on solderable elements for diffusion soldering20 Aug 2024US 12,069,802 B2Infineon Technologies AG
- Semiconductor packages and methods of packaging semiconductor devices25 Jul 2023US 11,710,681 B2UTAC Headquarters Pte. Ltd.
- Power semiconductor device with first and second sealing resins of different coefficient of thermal expansion25 Oct 2022US 11,482,462 B2Mitsubishi Electric Corporation
- Semiconductor device4 Oct 2022US 11,462,450 B2Fuji Electric Co., Ltd.
- Method of manufacturing semiconductor devices and corresponding semiconductor device3 Sep 2026US 2026/0262526 A1STMicroelectronics International N. V.
- Method of manufacturing a semiconductor package and such semiconductor package18 Jun 2026US 2026/0173938 A1Nexperia B. V.
- Method of forming a die package and die package arrangement25 Dec 2025US 2025/0391747 A1Infineon Technologies AG
- Dual switching power device27 Feb 2025US 2025/0070101 A1
- Pre-Plating of Solder Layer on Solderable Elements for Diffusion Soldering7 Nov 2024US 2024/0373548 A1Infineon Technologies AG
Most cited
By later US patents
- Semiconductor device using diffusion soldering5US 8,975,117 B2Infineon Technologies AG · 2015
- Semiconductor device and method of manufacturing the same2US 9,177,833 B2Renesas Electronics Corporation · 2015
- Low cost repackaging of thinned integrated devices2US 9,330,943 B2Apple Inc. · 2016
- Semiconductor device1US 10,103,090 B2Denso Corporation · 2018
- Clip structure and semiconductor package using the same1US 10,535,589 B2JMJ Korea Co., Ltd. · 2020