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US 2024/0373548 A1Published application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion Soldering
AssigneeInfineon Technologies AG
InventorsAlexander Heinrich, Alexander Roth
Life of this patent
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Abstract
A pre-soldered circuit carrier includes a carrier having a metal die attach surface, a plated solder region on the metal die attach surface, wherein a maximum thickness of the plated solder region is at most 50 μm, the plated solder region has a lower melting point than the first bond pad, and the plated solder region forms one or more intermetallic phases with the die attach surface at a soldering temperature that is above the melting point of the plated solder region.
Claims8
A pre-soldered circuit carrier, comprising:
- a carrier comprising a metal die attach surface;
- and
- a plated solder region on the metal die attach surface;
- wherein a maximum thickness of the plated solder region is at most 50 μm,
- wherein the plated solder region has a lower melting point than the die attach surface, and
- wherein the plated solder region forms one or more intermetallic phases with the die attach surface at a soldering temperature that is above the melting point of the plated solder region.
3 more elements
Dependencies are inferred from the claim text.