Semiconductor packages and methods of packaging semiconductor devices

A device comprising:

• a first die with first and second die surfaces, the second die surface is bonded, by a conductive die-substrate bonding layer, to a first die attach pad (DAP) disposed on a first substrate surface of a package substrate and the first die surface includes a first die contact pad;
• a first clip bond, wherein the first clip bond includes
• a first clip bond horizontal planar portion attached to the first die contact pad on the first die surface, and
• a first clip bond vertical portion disposed on an edge of the first clip bond horizontal planar portion, the first clip bond vertical portion is attached to a first substrate bond pad on the first substrate surface by a first conductive clip-substrate bonding layer;
• a first conductive clip-die bonding layer with spacers on the first die contact pad of the first die, the first conductive clip-die bonding layer bonds the first clip bond horizontal planar portion to the first die contact pad;
• a second die with first and second die surfaces, the second die surface is bonded to the first clip bond horizontal planar portion by a second conductive clip-die bonding layer with spacers and the first die surface includes a second die contact pad;
• a second clip bond, wherein the second clip bond includes
• a second clip bond horizontal planar portion attached to the second die contact pad on the first die surface, and
• a second clip bond vertical portion disposed on an edge of the second clip bond horizontal planar portion, the second clip bond vertical portion is attached to a second substrate bond pad on the first substrate surface;
• and
• a third conductive clip-die bonding layer with spacers on the second die contact pad of the second die, the third conductive clip-die bonding layer bonds the second clip bond horizontal planar portion to the second die contact pad.

A device comprising:

• a first die with first and second die surfaces, the second die surface is bonded to a first die attach pad (DAP) disposed on a first substrate surface of a package substrate and the first die surface includes a first die contact pad;
• a first clip bond having a horizontal planar portion attached to the first die contact pad on the first die surface;
• and
• a first conductive clip-die bonding layer with spacers dispersed therein, the first conductive clip bonding layer is disposed on the first die contact pad of the first die, the first conductive clip-die bonding layer bonds the first clip bond horizontal planar portion to the first die contact pad, wherein the spacers comprise a spacer size which is less than a Bond Line Thickness (BLT) of the first conductive clip-die bonding layer, the spacers facilitate in maintaining a uniform BLT.