Semiconductor device using diffusion soldering

A method comprising:

• providing a carrier;
• providing a contact clip fabricated by one or more of stamping, punching, pressing, cutting, sawing and milling;
• applying a first solder deposit to the carrier;
• placing a semiconductor chip on the first solder deposit;
• applying a second solder deposit to the semiconductor chip;
• placing the contact clip on the second solder deposit;
• and thereafter
• applying heat to the first and second solder deposits to form diffusion solder bonds between the carrier, the semiconductor chip and the contact clip, wherein applying heat comprises placing the carrier, the semiconductor chip and the contact clip in a furnace, wherein a maximum temperature applied by the furnace to the first and second solder deposits is between 250° C. and 350° C., and wherein no external pressure is applied to the carrier, the semiconductor chip and the contact clip while in the furnace.

A method comprising:

• providing a semiconductor chip having a first main surface and a second main surface, wherein the second main surface comprises an electrode;
• placing the semiconductor chip on a carrier with the first main surface of the semiconductor chip facing the carrier, wherein a first layer of solder material is provided between the first main surface and the carrier;
• placing a contact clip on the second main surface of the semiconductor chip, wherein a second layer of solder material is provided between the electrode and the contact clip;
• and
• placing the carrier and the semiconductor chip into a tunnel furnace to apply heat to the first and second layers of solder material to form a first diffusion solder bond between the carrier and the semiconductor chip and a second diffusion solder bond between the semiconductor chip and the contact clip, wherein a maximum temperature applied by the furnace to the first and second layers of solder material is between 250° C. and 350° C., and wherein no external pressure is applied to the carrier, the semiconductor chip and the contact clip while in the furnace.