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US 12,069,802 B2Granted
Pre-plating of solder layer on solderable elements for diffusion soldering
AssigneeInfineon Technologies AG
InventorsAlexander Heinrich, Alexander Roth
Life of this patent
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Abstract
A pre-soldered circuit carrier includes a carrier having a metal die attach surface, a plated solder region on the metal die attach surface, wherein a maximum thickness of the plated solder region is at most 50 μm, the plated solder region has a lower melting point than the first bond pad, and the plated solder region forms one or more intermetallic phases with the die attach surface at a soldering temperature that is above the melting point of the plated solder region.
Claims7
A method of forming a pre-soldered element, the method comprising:
- providing a substrate comprising a first metal joining surface;
- depositing a mask material on the substrate that covers the first metal joining surface;
- patterning the mask material to form an opening that exposes the first metal joining surface;
- and
- performing a plating process that forms a plated solder region on a portion of the first metal joining surface that is exposed by the opening;
- wherein the substrate is a carrier that is any one of:
- a direct bonded copper substrate, an active metal brazed substrate, or an insulated metal substrate,
- wherein the plated solder region has a lower melting point than the first metal joining surface, and
- wherein the plated solder region forms one or more intermetallic phases with the first metal joining surface at a soldering temperature that is above the melting point of the plated solder region.
6 more elements
A method of forming a pre-soldered element, the method comprising:
- providing a substrate comprising a first metal joining surface;
- depositing a mask material on the substrate that covers the first metal joining surface;
- patterning the mask material to form an opening that exposes the first metal joining surface;
- and
- performing a plating process that forms a plated solder region on a portion of the first metal joining surface that is exposed by the opening;
- wherein the substrate is a leadframe or a metal clip, and wherein the first metal joining surface is a die attach surface of the leadframe or the metal clip,
- wherein the plated solder region has a lower melting point than the first metal joining surface, and
- wherein the plated solder region forms one or more intermetallic phases with the first metal joining surface at a soldering temperature that is above the melting point of the plated solder region.
5 more elements
Dependencies are inferred from the claim text.