Low cost repackaging of thinned integrated devices
AssigneeApple Inc.
InventorShawn X. Arnold
Life of this patent
Estimating the term…
Abstract
A method for mounting and embedding a thinned integrated circuit within a substrate is provided. In one embodiment, the thinned integrated circuit can receive one or more biasing substrate layers on a first surface of the thinned integrated circuit. When the thinned integrated circuit is embedded within a supporting substrate, such as a printed circuit board, the biasing substrate layers can position the thinned integrated circuit toward a centerline of the printed circuit board. Positioning the thinned integrated circuit toward the centerline can increase the resistance to breakage.
Claims14
A method for forming a printed circuit assembly including a thinned integrated circuit, the method comprising:
- attaching additional substrate layers to the thinned integrated circuit forming a thinned integrated circuit sub-assembly, the thinned integrated circuit comprising a metallization layer;
- affixing the thinned integrated circuit sub-assembly to a cavity within a printed circuit board (PCB) substrate such that the thinned integrated circuit sub-assembly is aligned about mid-plane to a centerline of the PCB substrate;
- coupling at least one additional PCB substrate layer to cover the thinned integrated circuit sub-assembly;
- and
- forming at least one laser via through the additional substrate layers and the PCB substrate to the thinned integrated circuit.
A method of forming an embeddable thinned integrated circuit sub-assembly within a printed circuit board (PCB) substrate having a PCB thickness, comprising:
- attaching a substrate layer to a thinned integrated circuit comprising a metallization layer to form at least a partial thinned integrated circuit sub-assembly;
- determining if the partial thinned integrated circuit sub-assembly has a thickness sufficient for the partial thinned integrated circuit sub-assembly to align about a mid-plane of a centerline within the printed circuit board (PCB) substrate;
- and
- attaching additional substrate layers to the substrate layer until the thickness of the partial thinned integrated circuit sub-assembly is sufficient for the partial thinned integrated sub-assembly to align about the mid-plane in accordance with the determining;
- and
- forming at least one laser via through the at least one additional substrate layer to the thinned integrated circuit.
A printed circuit assembly, comprising:
- a printed circuit board (PCB) substrate having a cavity defined therein;
- a thinned integrated circuit sub-assembly disposed in the cavity in accordance with a mid-plane alignment with a centerline of the PCB substrate and comprising a metallization layer;
- and
- a PCB substrate layer covering the cavity;
- wherein the thinned integrated circuit sub-assembly comprises:
- a thinned integrated circuit;
- an additional substrate layer fixedly attached to the thinned integrated circuit;
- and
- at least one laser via formed through the additional substrate layer for communication between the PCB substrate and the thinned integrated circuit.
Dependencies are inferred from the claim text.