Method of fabricating an electronic circuit device

A method of soldering for use in fabricating an electronic circuit device, comprising the steps of:

• supplying a solder to a first member to be bonded to a second member, in the form of solder plating, vapor deposition, or a ball-like solder;
• supplying an organic material to at least one of said first and second members;
• aligning said first and second members in an oxidizing atmosphere;
• and
• heating said first and second members in a nonoxidizing atmosphere to remove at least an oxide layer and a contamination layer from the surface of at least one of said solder and said second member, and for bonding said first and second members to each other.

A fluxless bonding method for bonding together first and second members of an integrated circuit, comprising the steps of:

• supplying a solder to at least one of the first and second members in the form of solder plating, vapor depositioning, or a ball-like solder;
• supplying an organic material to at least one of said first and second members;
• aligning said first and second members in an oxidizing atmosphere;
• and
• heating said first and second members in a nonoxidizing atmosphere to remove an oxide layer and a contamination layer from the surface of one of said solder and said first and second members, and for bonding said first and second members to each other.