H10W 72/01661
Chemical or physical modification
Official title: {Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01651)}
H10W72/01661 (Chemical or physical modification) appears on 30 US grants and 38 published applications in this corpus.
Search patents in H10W- Granted patents
- 30
- Published applications
- 38
- Assignees
- 18
- Inventors
- 96
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 1 | 5 |
| 2016 | 3 | 3 |
| 2017 | 4 | 1 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 2 | 10 |
| 2021 | 6 | 4 |
| 2022 | 3 | 5 |
| 2023 | 4 | 2 |
| 2024 | 1 | 3 |
| 2025 | 3 | 1 |
| 2026 | 3 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Clip interconnect with micro contact heads2 Jun 2026US 12,648,455 B2Semiconductor Components Industries, LLC
- Roughened surface of a conductive wedge bonded ribbon encapsulated in a sermiconductor package10 Mar 2026US 12,575,468 B2STMicroelectronics S,r.l.
- Semiconductor device and method of forming clip bond having multiple bond line thicknesses13 Jan 2026US 12,525,567 B2UTAC Headquarters Pte. Ltd.
- Semiconductor device and a method of manufacture1 Jul 2025US 12,347,751 B2Nexperia B. V.
- Semiconductor package and related methods1 Jul 2025US 12,347,813 B2Semiconductor Components Industries, LLC
- Method of manufacturing a plurality of semiconductor devices as well as a corresponding semiconductor device24 Sep 2026US 2026/0293703 A1Nexperia B. V.
- Substrate Clip with Sheet and Patterned Electrically Conductive Structure Having Different Thicknesses14 May 2026US 2026/0136948 A1
- Semiconductor package and related methods18 Sep 2025US 2025/0293213 A1Semiconductor Components Industries, LLC
- Power leadframe package with lead sidewall surface that is fully solder wettable15 Aug 2024US 2024/0274572 A1STMicroelectronics International N. V.
- Semiconductor package and related methods29 Feb 2024US 2024/0072009 A1Semiconductor Components Industries, LLC
Most cited
By later US patents
- Semiconductor device including a contact clip having protrusions and manufacturing thereof6US 8,987,879 B2Infineon Technologies AG · 2015
- Semiconductor package and related methods4US 11,830,856 B2Semiconductor Components Industries, LLC · 2023
- Semiconductor package with multi-level conductive clip for top side cooling3US 11,075,185 B2Infineon Technologies AG · 2021
- Power semiconductor apparatus and fabrication method for the same3US 11,302,665 B2Rohm Co., Ltd. · 2022
- Power module and method of manufacturing power module3US 9,673,118 B2Mitsubishi Electric Corporation · 2017