Semiconductor package with multi-level conductive clip for top side cooling

A method of packaging a semiconductor device, the method comprising:

• providing a die pad comprising a die attach surface;
• providing a semiconductor die comprising a first bond pad and a second bond pad on an upper surface of the semiconductor die;
• mounting the semiconductor die on the die pad such that the first bond pad faces away from the die attach surface;
• providing an interconnect clip that comprises:
• a first segment which at least partially encloses a central opening;
• a second segment vertically offset and spaced apart from the first segment;
• and
• a support extending between the first segment and the second segment;
• mounting the interconnect clip on the semiconductor die such that a lower surface of the second segment is flush against the upper surface of the semiconductor die and conductively connected to the first bond pad;
• and
• forming an electrically insulating encapsulant such that the semiconductor die is covered by the encapsulant and such that an upper surface of the first segment of the interconnect clip is exposed from an upper surface of the encapsulant, and
• wherein from a plan view perspective of the interconnect clip the second bond pad is outside of a footprint of the interconnect clip.

An interconnect clip, comprising:

• a first segment which at least partially encloses a central opening;
• a second segment vertically offset and spaced apart from the first segment;
• and
• one or more supports extending between the first segment and the second segment,
• wherein from a plan view perspective of the interconnect clip, the interconnect clip has an L-shaped geometry, and
• wherein the first segment comprises a first elongated span and a second elongated span that intersects with the first elongated span, and wherein the first elongated span and the second elongated span form an inner corner of an outer edge of the interconnect clip, wherein the central opening meets the inner corner.