Power leadframe package with lead sidewall surface that is fully solder wettable

A power leadframe integrated circuit package, comprising:

• a leadframe including a lead region and a die pad region separated by a space;
• an integrated circuit die mounted to an upper surface of the die pad region;
• a first metal clip having a chip mounting portion mounted to the integrated circuit die, said first metal clip further including a lead mounting portion mounted to the lead region and a first residual bridge portion;
• a second metal clip including a second residual bridge portion mounted to the die pad region;
• an encapsulating body encapsulating the leadframe, the integrated circuit die and the first and second metal clips;
• wherein said encapsulating body has a first peripheral sidewall at which an end of said first residual bridge portion is exposed and has a second peripheral sidewall, opposite said first peripheral sidewall, at which an end of said second residual bridge portion is exposed;
• wherein a sidewall of the lead region is exposed at said first peripheral sidewall of the encapsulating body, and wherein a sidewall of the die pad region is exposed at said second peripheral sidewall of the encapsulating body;
• and
• a plating layer on all of said sidewall of the lead region and all of said sidewall of the die pad region.