H10W 72/01651
Changing the shapes of strap connectors
Official title: {Changing the shapes of strap connectors}
H10W72/01651 (Changing the shapes of strap connectors) appears on 26 US grants and 34 published applications in this corpus.
Search patents in H10W- Granted patents
- 26
- Published applications
- 34
- Assignees
- 19
- Inventors
- 80
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2013 | 0 | 1 |
| 2014 | 1 | 2 |
| 2015 | 1 | 0 |
| 2016 | 1 | 1 |
| 2017 | 2 | 2 |
| 2018 | 1 | 1 |
| 2019 | 1 | 0 |
| 2020 | 1 | 4 |
| 2021 | 2 | 3 |
| 2022 | 1 | 6 |
| 2023 | 4 | 4 |
| 2024 | 3 | 4 |
| 2025 | 5 | 4 |
| 2026 | 3 | 2 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the method8 Sep 2026US 12,733,527 B2JMJ Korea Co., Ltd.
- Roughened surface of a conductive wedge bonded ribbon encapsulated in a sermiconductor package10 Mar 2026US 12,575,468 B2STMicroelectronics S,r.l.
- Semiconductor device and method of forming clip bond having multiple bond line thicknesses13 Jan 2026US 12,525,567 B2UTAC Headquarters Pte. Ltd.
- Flex bonded integrated circuits7 Oct 2025US 12,438,114 B2Meta Platforms, Inc.
- Semiconductor devices having exposed clip top sides and methods of manufacturing semiconductor devices16 Sep 2025US 12,418,135 B2Amkor Technology Singapore Holding Pte.Ltd.
- Substrate Clip with Sheet and Patterned Electrically Conductive Structure Having Different Thicknesses14 May 2026US 2026/0136948 A1
- Transistor chip package with bent clip19 Mar 2026US 2026/0082939 A1
- Semiconductor devices and methods of manufacturing semiconductor devices4 Dec 2025US 2025/0372914 A1Amkor Technology Singapore Holding Pte.Ltd.
- Connecting strip for discrete and power electronic devices16 Oct 2025US 2025/0323205 A1STMicroelectronics S,r.l.
- Semiconductor package and related methods18 Sep 2025US 2025/0293213 A1Semiconductor Components Industries, LLC
Most cited
By later US patents
- Semiconductor device including a contact clip having protrusions and manufacturing thereof6US 8,987,879 B2Infineon Technologies AG · 2015
- Semiconductor package and related methods4US 11,830,856 B2Semiconductor Components Industries, LLC · 2023
- Semiconductor device and method of manufacturing the same2US 9,337,129 B2Rohm Co., Ltd. · 2016
- Multi-clip structure for die bonding1US 11,189,592 B2Infineon Technologies Austria AG · 2021
- Semiconductor devices having exposed clip top sides and methods of manufacturing semiconductor devices1US 11,611,170 B2Amkor Technology Singapore Holding Pte.Ltd. · 2023