H10W 72/01653
By etching
Official title: {by etching}
H10W72/01653 (By etching) appears on 12 US grants and 14 published applications in this corpus.
Search patents in H10W- Granted patents
- 12
- Published applications
- 14
- Assignees
- 8
- Inventors
- 38
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 1 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 3 |
| 2021 | 2 | 2 |
| 2022 | 0 | 2 |
| 2023 | 3 | 2 |
| 2024 | 1 | 1 |
| 2025 | 2 | 1 |
| 2026 | 2 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Roughened surface of a conductive wedge bonded ribbon encapsulated in a sermiconductor package10 Mar 2026US 12,575,468 B2STMicroelectronics S,r.l.
- Semiconductor device and method of forming clip bond having multiple bond line thicknesses13 Jan 2026US 12,525,567 B2UTAC Headquarters Pte. Ltd.
- Semiconductor device and a method of manufacture1 Jul 2025US 12,347,751 B2Nexperia B. V.
- Semiconductor package and related methods1 Jul 2025US 12,347,813 B2Semiconductor Components Industries, LLC
- Electrical connection member, electrical connection structure, and method for manufacturing electrical connection member24 Dec 2024US 12,176,315 B2Hitachi Metals, Ltd.
- Substrate Clip with Sheet and Patterned Electrically Conductive Structure Having Different Thicknesses14 May 2026US 2026/0136948 A1
- Semiconductor package and related methods18 Sep 2025US 2025/0293213 A1Semiconductor Components Industries, LLC
- Semiconductor package and related methods29 Feb 2024US 2024/0072009 A1Semiconductor Components Industries, LLC
- Method of manufacturing semiconductor devices, corresponding semiconductor device and ribbon for use therein13 Apr 2023US 2023/0114535 A1STMicroelectronics S,r.l.
- Semiconductor device having a metal clip with a solder volume balancing reservoir30 Mar 2023US 2023/0094794 A1Infineon Technologies AG
Most cited
By later US patents
- Semiconductor device including a contact clip having protrusions and manufacturing thereof6US 8,987,879 B2Infineon Technologies AG · 2015
- Semiconductor package and related methods4US 11,830,856 B2Semiconductor Components Industries, LLC · 2023
- Multi-clip structure for die bonding1US 11,189,592 B2Infineon Technologies Austria AG · 2021
- Flip chip packaging1US 9,666,556 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017