H10W 72/01671
Cleaning
Official title: {Cleaning, e.g. oxide removal or de-smearing}
H10W72/01671 (Cleaning) appears on 10 US grants and 13 published applications in this corpus.
Search patents in H10W- Granted patents
- 10
- Published applications
- 13
- Assignees
- 8
- Inventors
- 27
- Latest grant
- 4 Oct 2022
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|---|---|---|
| 2012 | 0 | 1 |
| 2013 | 1 | 2 |
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| 2015 | 2 | 1 |
| 2016 | 1 | 2 |
| 2017 | 2 | 2 |
| 2018 | 0 | 1 |
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| 2020 | 2 | 0 |
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| 2022 | 1 | 0 |
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Recent patents
- Low stress asymmetric dual side module4 Oct 2022US 11,462,515 B2Semiconductor Components Industries, LLC
- Semiconductor device and method with clip arrangement in IC package3 Nov 2020US 10,825,757 B2Nexperia B. V.
- Method for fabricating stack die package28 Jan 2020US 10,546,840 B2Vishay-Siliconix
- Semiconductor device including a clip24 Sep 2019US 10,424,534 B2Infineon Technologies AG
- Semiconductor device including a clip2 May 2017US 9,640,465 B2Infineon Technologies AG
- Semiconductor device assembly, method for manufacturing same, and application thereof18 Jul 2024US 2024/0243095 A1Chongqing Alpha and Omega Semiconductor Limited
- Low stress asymmetric dual side module4 Feb 2021US 2021/0035956 A1Semiconductor Components Industries, LLC
- Semiconductor device and method with clip arrangement in ic package21 Jun 2018US 2018/0174951 A1Nexperia B. V.
- Semiconductor device including a clip31 Aug 2017US 2017/0250125 A1Infineon Technologies AG
- Method for fabricating stack die package8 Jun 2017US 2017/0162403 A1Vishay-Siliconix
Most cited
By later US patents
- Method for fabricating stack die package23US 9,589,929 B2Vishay-Siliconix · 2017
- IGBT power semiconductor package having a conductive clip7US 8,354,733 B2International Rectifier Corporation · 2013
- Stacked synchronous buck converter having chip embedded in outside recess of leadframe6US 9,184,121 B2Texas Instruments Incorporated · 2015
- Method for fabricating stack die package4US 10,546,840 B2Vishay-Siliconix · 2020
- Low stress asymmetric dual side module4US 11,462,515 B2Semiconductor Components Industries, LLC · 2022