Semiconductor device and method with clip arrangement in IC package

An apparatus comprising:

• an integrated circuit (IC) package including a lead frame and a conductor;
• a die having circuitry and electrically connected to the lead frame;
• a surface area of the die having an outer non-solderable passivation region along adjacent edges of the die surface, and having a solderable inner region arranged from a center portion of the surface up to inner region boundaries at which the solderable inner region ends and the outer non-solderable passivation region begins, wherein the solderable inner region is configured with a width between opposing portions of the outer non-solderable passivation region, and is electrically coupled and secured to the conductor via solder;
• and
• an electrically-conductive clip connected between the conductor and the circuitry of the die via a trough portion in a finger portion of the electrically-conductive clip, the finger portion having a length that extends across and toward the solderable inner region of the die and with the trough portion connected to a die contact trough region of the solderable inner region, and the finger portion extending beyond a far boundary of one of the inner region boundaries and thereby overlapping at least a portion of the outer non-solderable passivation region in a first direction along a plane parallel to the surface area, wherein the finger portion has a bottom surface that extends beyond the far boundary and is parallel to the surface area, wherein the finger portion is sufficiently narrow such that on all sides of the die contact trough region, the inner solderable region is exposed after soldering,
• wherein the finger portion of the electrically-conductive clip has a width, along another second direction perpendicular to the first direction along the plane, that is less than the width of the solderable inner region, and wherein the width of the finger portion of the clip, from a top-down perspective along a direction orthogonal to the plane, is configured and arranged to expose the solderable inner region with at least 10% on each opposing side of the finger portion.