Method for fabricating stack die package
AssigneeVishay-Siliconix
InventorsKyle TERRILL, Frank KUO, Sen MAO
Life of this patent
Estimating the term…
Abstract
In one embodiment, a method can include coupling a gate and a source of a first die to a lead frame. The first die can include the gate and the source that are located on a first surface of the first die and a drain that is located on a second surface of the first die that is opposite the first surface. In addition, the method can include coupling a source of a second die to the drain of the first die. The second die can include a gate and the source that are located on a first surface of the second die and a drain that is located on a second surface of the second die that is opposite the first surface.
Claims20
A method comprising:
- coupling a gate and a source of a first die to a lead frame, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface;
- and
- coupling a source of a second die to said drain of said first die, said second die comprising a gate and said source that are located on a first surface of said second die and a drain that is located on a second surface of said second die that is opposite said first surface.
A method comprising:
- coupling a gate and a source of a first die to a lead frame, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said first die comprising split gate technology;
- and
- coupling a source of a second die to said drain of said first die, said second die comprising a gate and said source that are located on a first surface of said second die and a drain that is located on a second surface of said second die that is opposite said first surface.
A method comprising:
- coupling a gate and a source of a first die to a lead frame, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said first die comprising split gate technology;
- coupling a first clip to said lead frame and said drain of said first die;
- coupling a second clip to said lead frame;
- coupling a source of a second die to said first clip;
- coupling a gate of said second die to said second clip, said second die comprising said gate and said source that are located on a first surface of said second die and a drain that is located on a second surface of said second die that is opposite said first surface, said second die comprising split gate technology;
- and
- coupling a third clip to said lead frame and said drain of said second die.
Dependencies are inferred from the claim text.