Semiconductor device assembly, method for manufacturing same, and application thereof

Abstract

A semiconductor device assembly, a method for manufacturing the same, and an application thereof are provided. The semiconductor device assembly includes metal frames, semiconductor device units, and chip stages. The semiconductor device units include chips, pins, and connectors. The semiconductor device units are paired to form at least one semiconductor device pair, and are arranged in sequence along a length direction or a width direction of the metal frames. Encapsulation layers are arranged along an arrangement direction of the semiconductor device units. A redundant frame structure configured to carry and isolate single products of the metal frames is simplified, thereby increasing a density of the single products on each of the metal frames by at least 30%, facilitating cutting of the semiconductor device assembly, and facilitating bending of the pins exposed outside after cutting, so as to ensure that the pins meet design requirements in specific occasions.

Dependencies are inferred from the claim text.