Semiconductor device and method with clip arrangement in ic package

A method for an integrated circuit (IC) package including a semiconductor die with circuitry and including at least one lead frame, the method comprising:

• conducting electricity between the circuitry in the die and the lead frame via an electrically-conductive clip, wherein the die includes a surface area having an outer non-solderable passivation region along adjacent edges of the die surface, and having a solderable inner region arranged from a center portion of the surface area up to inner region boundaries at which the solderable inner region ends and the outer non-solderable passivation region begins, wherein the solderable inner region has a width between opposing portions of the outer non-solderable passivation region for electrically coupling and securing to the conductor via solder;
• while passing current through the clip, dissipating heat as generated by the current by using a trough portion in a finger portion of the clip, the finger portion of the clip having a length that extends across and toward the solderable inner region of the die and connecting to the solderable inner region, and wherein finger portion extends beyond one of the inner region boundaries and thereby overlaps at least a portion of the outer non-solderable passivation region in a first direction along a plane parallel to the surface area;
• and
• wherein the step of dissipating heat employs the finger portion of clip having a width, along a second direction perpendicular to the first direction along the plane, that is less than the width of the solderable inner region.