Semiconductor package including preformed support structure
AssigneeSamsung Electronics Co., Ltd.
InventorPeng Zhang
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Abstract
Provided is a semiconductor package including a preformed support structure. The semiconductor package includes a substrate, the preformed support structure provided on the substrate, the preformed support structure including a first chip encapsulated with a first molding material, a plurality of second chips, at least one of the second chips being provided on the preformed support structure, and a third chip provided on the second chips, wherein the first chip has a first size, each of the second chips has a second size, the third chip has a third size, and the first size is smaller than the second size and the third size, and wherein a top surface of the at least one of the second chips is at the same height level as top surfaces of other ones of the second chips.
Claims20
A semiconductor package, comprising:
- a substrate;
- a support structure provided on the substrate, the support structure comprising a first chip encapsulated with a first molding material;
- a plurality of second chips, at least one of the plurality of second chips being provided on the support structure;
- and
- a third chip provided on the plurality of second chips,
- wherein the first chip has a first size, a first second chip of the plurality of second chips has a second size, a second second chip of the plurality of second chips has the second size, the third chip has a third size,
- wherein the first size is smaller than the second size and the third size, and
- wherein a top surface of the at least one of the plurality of second chips is at a same height level as top surfaces of other ones of the plurality of second chips.
A semiconductor package, comprising:
- a substrate;
- a support structure provided on the substrate, the support structure comprising a first chip encapsulated with a first molding material;
- a plurality of second chips provided on the support structure;
- and
- a third chip provided on the plurality of second chips,
- wherein the first chip has a first size, a first second chip of the plurality of second chips has a second size, a second second chip of the plurality of second chips has the second size, the third chip has a third size, and
- wherein the first size is smaller than the second size.
Dependencies are inferred from the claim text.